收藏本站
Philips Semiconductors
UM_1SPP
BGB203 BT 2.0 Serial Port Profile Module User’s Guide
Table 3: DTE Signals
Signal
CD
RI
DTR
DSR
RTS
CTS
Direction
Input
Input
Output
Input
Output
Input
Description
Carrier Detect
Ring Indicator signal
Data Terminal Ready signal
Data Set Ready signal
Ready to Send signal
Clear to Send signal
The 1SPP firmware provides the ability to control Bluetooth low power settings (while in
data mode). These settings, if enabled, utilize the Bluetooth sniff mode, and can
drastically reduce the power consumption used for active Bluetooth connections. The
trade-off for this reduced power is that the latency is increased. This is a facet of the
Bluetooth sniff mode, since the link is only being serviced at regular intervals. Any data
that needs to be sent or received during the sniff interval will have to wait until the interval
expires before it can be set. The 1SPP firmware allows the configuration of this interval
so that the host processor can determine the best latency/power consumption tradeoff
(see the AT+BTPWR command more information).
In addition to Bluetooth low power settings (while in data mode), the 1SPP firmware
allows the ability to reduce power consumption while in command mode. This mode is
known as deep sleep mode and can be entered from command mode by using the
AT+BTSLP command. Deep sleep mode allows the 1SPP firmware to reduce the power
consumption of the chip to micro-Amp (uA) levels when no functionality is required of the
device. The device can be woken from deep sleep mode by utilizing either DTR/DSR or
using the RESET_N line of the BGB203. When the device is woken from deep sleep
mode it retains all prior configuration information (unless the chip is woken by the
RESET_N line in which case the chip is reset completely). This functionality allows the
host to reduce the power consumption of the 1SPP device during periods of inactivity (i.e.
the host does not require any services of the 1SPP device).
When the 1SPP device is operating in command mode (i.e. it is accepting commands)
other Bluetooth functionality is available. This functionality allows the local device the
ability to configure local settings as well as the ability to interactively discover other
Bluetooth devices and the services that those devices support. See the 1SPP command
set documentation for a detailed description of the features that are provided in this
category.
In addition to the above device configuration and Bluetooth functionality, the 1SPP
firmware provides features to aid in device qualification and testing (both Bluetooth and
FCC). The 1SPP command set documentation contains a detailed description of these
commands. The commands that are useful for this purpose are the AT+BTTST ,
AT+BTTX , and AT+BTRXT commands.
? Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release:21 Dec 2005
Published in The Netherlands
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
2.0 X 3.0 X 0.50 SHIELD RF STD 2 X 3 X .5"
2 INCH-D2-MV-MINI SENSOR 2" H2O D MV DUAL OS
2000310 PRESSURE TRANSDUCER MSP SERIES
2008639-1 LIGHT SCKT 10MM HI INTENST ASSY
2008675-1 STAR BOARD LED HOLDER/HEATSINK
202FG1K THERMISTOR NTC 2.0K 10% DO-35
203-0111-200 CAP MINI DIMMER PANEL IND RED
203JL1A THERMISTOR NTC 20K OHM +/-0.50 C
相关代理商/技术参数
1SPTG040317 制造商:LG Corporation 功能描述:SCREW,TAPPING[TRUSS HEAD]
1SQ-25-GM110 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带，粘合剂 >> 带 系列:GM110 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬，载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶，载体，衬垫:- 宽:1.00"（25.40mm） 长度:360'（109.7m）120 码 颜色:白色字符，绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-25-GM400 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带，粘合剂 >> 带 系列:GM400 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬，载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶，载体，衬垫:- 宽:1.00"（25.40mm） 长度:360'（109.7m）120 码 颜色:白色字符，绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-28-8997 功能描述:POLY TAPE 1"X1" ROLL OF 28 制造商:3m (tc) 系列:* 零件状态:有效 标准包装:1
1SR124-100 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-100A 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-200 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-200A 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES